FCSP0530ETR diodes equivalent, chip scale packaging to deliver schottky diodes.
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* Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer.
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* Reverse polarity protection Current steering Freewheeling Flyback Oring
FlipKY®
DESCRIPT.
FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board spac.
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